What’s 3D IC, and what’s causing the shift from 2D IC to 3D IC? How does this new technology relate to heterogeneous integration and advanced packaging? What is required for a successful 3D IC ...

Ansys Redhawk-SC™ and Ansys Redhawk-SC Electrothermal™ have been certified by United Microelectronics Corporation (UMC) to simulate its latest 3D integrated circuit (3D-IC) packaging technology Chip ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

The Industrial Technology Research Institute (ITRI) has partnered with microcontroller unit (MCU) manufacturer Generalplus to develop a wireless oral sensing capsule for medical inspection services.

With the rapid rise of emerging technologies such as AI, high-performance computing (HPC) and 5G, demand for improved chip ...

Ansys (ANSS) artificial intelligence (AI)-driven solutions demonstrate higher productivity when designing components of 3D integrated circuits (ICs) and provide seamless automation for critical tasks ...

PITTSBURGH, Oct. 17, 2019 /PRNewswire/-- Samsung Foundry certified ANSYS (NASDAQ: ANSS) multiphysics simulation solutions for its latest multi-die integration TM (MDI ...

As three-dimensional integrated circuit technology becomes the architectural backbone of AI, high-performance computing (HPC) ...

At the 2024 North America Technology Symposium, TSMC demonstrated its latest semiconductor process, advanced packaging, and 3D IC technologies, which will drive the next wave of AI developments with ...

The MarketWatch News Department was not involved in the creation of this content. BOSTON, April 18, 2024 /PRNewswire/ -- Semiconductor packaging has evolved from traditional 1D PCB levels to ...

Semiconductor packaging has evolved from traditional 1D PCB levels to cutting-edge 3D hybrid bonding at the wafer level, achieving interconnecting pitches as small as single micrometers and over 1000 ...