Monterey, Calif. – A host of new challenges is quickly descending on IC physical design, according to presenters at the International Symposium on Physical Design 2003 here earlier this month.
As designers move to 65nm technologies and below, the convergence of performance-driven design constraints and yield-driven manufacturing constraints intensifies the demand for new approaches for ...
Historically IC package design has been a relatively simple task which allowed the die bumps to be fanned out on a package substrate to a floorplan geometry suitable for connecting to a printed ...
The FICS Research Institute (University of Florida) has published a new research paper titled “Secure Physical Design.” This is the first and most comprehensive research work done in this area that ...
SpringSoft Completes OpenAccess-Compatible IC Layout Flow with Enhancements to Laker ADP Design Entry System The Laker™ Advanced Design Platform integrates the full-featured Laker schematic editor, ...
SAN DIEGO, Feb. 02, 2021 (GLOBE NEWSWIRE) -- GBT Technologies Inc. (OTC PINK: GTCH) ("GBT” or the “Company”), started a research project, internal name VeriSpeed, to develop new system and methods to ...
The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...
The urgency for change: Are traditional DRC debug flows enough? Physical verification engineers know all too well the reality of debugging massive integrated circuit (IC) designs. For years, the ...
When analyzing the supply and demand of global semiconductor design talents in 2021, one finds US-based companies to be the main source of chip design demand. US-based companies accounted for 43% of ...
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