Great Lakes Semiconductor (GLS) and Advanced Printed Electronic Solutions (APES) have entered a strategic partnership to launch a new initiative focused on advanced semiconductor packaging and ...

Taiwan Semiconductor Manufacturing (NYSE:TSM) announces breakthrough advances in advanced packaging technologies, aiming to ...

Glass Interposers Market Poised for Strong Growth as Advanced Semiconductor Packaging and High-Performance Computing Demand Accelerates: Verified Market Research (R) The global Glass Interposers ...

Q4 2025 Management View CEO Michael Plisinski highlighted that Onto Innovation ended 2025 "on a high note with orders from 2.5D packaging for AI devices more than doubling in the quarter, contributing ...

In today’s rapidly advancing technological era, AI has become a powerful catalyst for innovation and progress. Advanced semiconductor packaging plays a crucial role in supporting AI development, while ...

Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, today announced revised plans for the location of the company’s new semiconductor advanced ...

Foxconn's move from assembly to semiconductor packaging in India marks a strategic deepening that could accelerate local supply-chain integration and influence global EMS competition, even as ...

TEMPE, Ariz.--(BUSINESS WIRE)-- Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, in collaboration with the Trump Administration, today announces ...

Samsung Electronics (OTC:SSNLF) earmarked 25 billion yen ($170 million) to establish an advanced chip packaging R&D center in Yokohama, Japan, intensifying its competition with Taiwan Semiconductor ...

TOKYO--(BUSINESS WIRE)--Resonac Corporation (President and CEO: Hidehito Takahashi, hereinafter “Resonac”) today announced the establishment of "JOINT3," a co-creation evaluation framework formed by a ...

Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...

CFO Naixi Wu reported, "indie's fourth quarter revenue was $58 million, exceeding the midpoint of our outlook by $1 million, representing sequential growth of approximately 8% and flat compared to the ...