An explosion in design complexity, fueled by increased transistor density and fundamental shifts in chip architectures, are beginning to overwhelm traditional approaches to test. Defects can show up ...

As the semiconductor industry increasingly moves to chiplets, 2.5D/3D packaging, and heterogeneous integration, there are significant new challenges for test. Leaders like Teradyne have the ...

The types of devices being deployed in cars and how they differ in functionality. Why each device type requires a different test technique. Determining the best approach for the specific application.

During standardized chip fabrication, integrate circuit (IC) testing is conducted repeatedly to inspect the chips once they are manufactured. IC testing begins with wafer penetration before etched ...

SANTA ROSA, Calif.--(BUSINESS WIRE)--Keysight Technologies, Inc. (NYSE: KEYS) has enhanced its double-pulse test portfolio enabling customers to benefit from accurate and easy measurement of the ...

As we approach the physical limits of semiconductors, new technologies are required to develop advanced chips. New materials, device types and more efficient architectures and packaging are necessary ...

NI (Nasdaq: NATI), the provider of solutions that enable engineers and scientists to solve the world’s greatest engineering challenges, announced the NI Semiconductor Test System (STS) series. These ...

Teradyne TER is experiencing strong growth in its semiconductor test segment. In the third quarter of 2025, Semiconductor Test revenues rose 7% year over year and 23% sequentially, accounting for 78.8 ...

Easily and accurately measure dynamic characteristics on a Wide-Bandgap power semiconductor bare chip without soldering or probe needles Keysight fixture enables quick, repeated test without damaging ...