NXP’s RF Airfast multi-chip modules offer a common footprint across frequency and power for different regions NXP’s RF Airfast multi-chip modules offer a common footprint across frequency and power ...

New-generation Airfast RF Multi-Chip Modules (MCMs) extend frequency coverage to 4.0 GHz, leveraging the performance of NXP’s latest LDMOS technology and integration design techniques Higher output ...

EINDHOVEN, The Netherlands, June 06, 2023 (GLOBE NEWSWIRE) -- NXP Semiconductors (NASDAQ: NXPI) announced today a family of top-side cooled RF amplifier modules, based on a packaging innovation ...

NXP Semiconductors is making available its 2nd generation of comprehensive Airfast RF power Multi-Chip Modules (MCMs) designed to support the evolution of 5G mMIMO active antenna system requirements ...

NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...

NXP Semiconductors has announced a family of top-side cooled radio frequency (RF) amplifier modules, based on a packaging design intended to enable thinner and lighter radios for 5G infrastructure.

Yet another mainstay of classic analog engineering, the magnetron, is being targeted for silicon replacement. In the last year or so, RF semiconductors aimed at heating applications have started to ...

Eindhoven, Netherlands, July 26, 2010 – NXP Semiconductors today announced its acquisition of Jennic, a leading developer of low power RF solutions for wireless applications in smart energy, ...

NEC’s Massive MIMO 5G antenna RU features a 5G open virtual radio access network (vRAN) interface and has been adopted by Rakuten Mobile for its fully virtualized cloud-native mobile network. The RU ...