In the past few years, there have been a number of announcements involving advanced packaging architectures for semiconductor devices. These architectures offer product designers tremendous ...

Unlike the traditional system on chip (SoC) design process, which has fully qualified verification methods embodied in the form of process design kits (PDKs), chip design companies and outsourced ...

As Intel launches its new foundry business, its first customers include Qualcomm and Amazon Web Services, the chipmaker said Monday. Intel also shared the process and packaging technology roadmap that ...

Arteris, Inc. has announced the launch of Magillem Packaging, a new software aimed at simplifying and accelerating the chip design process, particularly for advanced technologies in AI and edge ...

In order to assist manufacturers in complying with the ISO 11607 standard requirements for packaging process development, equipment manufacturers are increasingly incorporating validation software and ...

Apple Inc.’s upcoming M5 line of Mac chips will be made using Taiwan Semiconductor Manufacturing Co.’s three-nanometer N3P process, 9to5Mac reported today. The publication attributed the information ...

Intel has revealed the roadmap of its process and packaging innovations that will power the next wave of products through 2025 and beyond. Save my User ID and Password Some subscribers prefer to save ...

SANTA CLARA, Calif.--(BUSINESS WIRE)--Intel is accelerating its annual cadence of innovation with new advancements in semiconductor process and packaging as part of its IDM 2.0 strategy. Join a ...

When one thinks of leading-edge semiconductor companies, companies such as Intel, AMD, and Samsung instantly come to mind. But as more semiconductor companies emphasize IP and outsource their ...