CHANDLER, Ariz., Dec. 06, 2023 (GLOBE NEWSWIRE) -- The E-Mobility, sustainability and data center markets require products that are conducive to high-volume ...
Press-fit terminals provide a solder-free capability to mount power modules to a printed circuit board (PCB). Microchip Technology Inc. has announced a broad portfolio of SP1F and SP3F power modules ...
Power semiconductor packages are used in high temperature, high voltage environments. With the increase of electric vehicles (EVs) and hybrid electric vehicles (HEV) in the automotive market, demands ...
STEINHAGEN, Germany, Nov. 12, 2025 /PRNewswire/ -- As demand for high-performance power electronics continues to rise across automotive, industrial, and data center applications, manufacturers are ...
Delamination around the perimeter of glass//glass modules has been the most common issue arising from PQP testing over 2025. Image: Kiwa PVEL. Looks matter when it comes to PV modules. At Kiwa PVEL, ...
In the wake of the AI and Electric Vehicle (EV) era, efficient power supply and conversion have become a critical battleground. For over a decade, 3S Silicon Tech has been deeply committed to ...
Although LGA (land grid array) and BGA (ball grid array) packaging seem quite similar – LGA packaging is basically BGA packaging without the solder balls – there are some significant differences that ...
SHENMAO Technology proudly presents its latest innovation, the PF719-P250A solder paste, specifically designed for AI substrate power management modules. This cutting-edge solder paste represents a ...
Previously, a Power Electronics Technology article titled “Inverted Acoustic System Cuts IGBT Failures” (September 2011) examined the use of an acoustic microscope to image heat-blocking defects such ...
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