Yahoo Finance

ACM Research Receives Purchase Contract for Ultra ECP ap High-Speed Plating Systems

FREMONT, Calif., May 06, 2022 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
Yahoo Finance

ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications in Compound Semiconductor Manufacturing

FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...
EDN

Applied Reveals Next Generation Plating Tool

Applied Materials Inc. introduced its 300mm SlimCell electrochemical plating (ECP) system today, likening its technology over that of standard ECP to that of single wafer processing vs. batch ...
Business Insider

ACM Research Delivers First Horizontal Panel Electroplating Tool Strengthening Its Leadership in Fan-Out Panel-Level Packaging

ACM’s Ultra ECP ap-p enables next generation device performance amid accelerating market demand for advanced packaging SEMICON EUROPA, Munich, Nov. 16, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc.
EDN

Novellus debuts copper plating tool for 65-, 45-nm ICs

SAN JOSE–Enabling a new round of copper-based devices, Novellus Systems Inc. today (December 1, 2003) rolled out its next-generation electrochemical plating (ECP) tool for use in 65- and 45-nm chip ...
Nasdaq

ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications in Compound Semiconductor Manufacturing

FREMONT, Calif., Aug. 25, 2021 (GLOBE NEWSWIRE) -- ACM Research, Inc. (ACM) (NASDAQ: ACMR), a leading supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) ...