SAN JOSE, Calif.--(BUSINESS WIRE)--KIOXIA America, Inc. today announced that its KIOXIA LC9 Series 245.76 terabyte (TB) 1 enterprise SSD, utilizing a 32-die stack KIOXIA BiCS FLASH™ generation 8 QLC ...

Intel has released a new package for stacking memory chips that will let manufacturers put more memory into cell phones without increasing the size of the handsets. The new package, called the ...

The company unveils a new package for stacking memory chips that will let manufacturers put more memory into cell phones without increasing the size of the handsets. Michael Kanellos is editor at ...

JEDEC is still finalizing the HBM4 memory specifications, with Rambus teasing its next-gen HBM4 memory controller that will be prepared for next-gen AI and data center markets, continuing to expand ...

In the world of solid-state memory fabs, bits per mm 2 rule. In the memory packaging market, mm 2 of silicon per a given package thickness is the defining feature. Both the memory architecture of the ...