TOKYO--(BUSINESS WIRE)-- Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...
WILMINGTON, Mass.--(BUSINESS WIRE)--Onto Innovation Inc. (NYSE: ONTO) today announced Onto Innovation’s glass substrate suite featuring the JetStep ® X500 panel-level packaging lithography system with ...
The joint venture MOU is part of a strategy to overcome the limitations of package substrate technology amid the rapid advancement of artificial intelligence (AI) and high-performance computing (HPC).
Dublin, Oct. 07, 2025 (GLOBE NEWSWIRE) -- The "The Global Market for Glass Substrates for Semiconductors 2026-2036" report has been added to ResearchAndMarkets.com's offering. The Global Glass ...
Glass substrates, long viewed as a promising next-generation component in advanced chip packaging, are now nearing real-world deployment, as Samsung Electronics signals a transition away from ...
Samsung Electro-Mechanics is gaining an edge in the industry's race to commercialize glass core substrates, a next-generation semiconductor packaging material, by agreeing to establish a joint venture ...
With the consumer electronics market approaching saturation, panel manufacturers from Taiwan and China are seeking new avenues for growth. Firms like BOE and Innolux are shifting toward advanced ...
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