The U.S. heterogeneous integration market is estimated at USD 0.47 billion in 2025E and is projected to grow at a CAGR of 22.99% from 2026 to 2033, reaching USD 2.47 billion. Growth is driven by ...

The Defense Advanced Research Projects Agency (DARPA) is helping to foster the next wave of microelectronics, the development and manufacturing of so-called three-dimensional heterogeneous integration ...

Manufacturing-aware system design treats dies, interposers, packages, and analysis as a single, coherent system.

Feb. 21, 2024 — EDA software company Cadence and Intel Foundry have collaborated to develop an integrated advanced packaging flow utilizing Embedded Multi-die Interconnect Bridge (EMIB) technology to ...

It has taken decades of research and development and strong commitment to various industry programs, but the stars are finally aligning for 3D semiconductor systems. No one could have left the 3D & ...

SEMICON Taiwan 2024 is set to take place from September 4-6 at the Taipei Nangang Exhibition Center, spotlighting key industry themes such as the AI value chain, advanced processes, heterogeneous ...

The development of computing technology in the late 18th century led to a change in computer architecture from the 1960s 2D drawing age to the present-day machine learning era, which uses algorithms, ...

Review these critical steps for choosing microelectronics and learn how a manufacturer can help integrate them into your next ...