TOKYO--(BUSINESS WIRE)-- Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a Glass Core Substrate (GCS) targeting next-generation semiconductor packages. The new product replaces ...

Subsidiaries of the Samsung Group will collaborate to invest in the research and development of Glass Core Substrates (GCS) to expedite their commercialization — and which Apple is eyeing, according ...

KAOHSIUNG, Sept. 2, 2024 /PRNewswire/ -- E&R Engineering Corp. (8027.TWO) hosted an event on August 28, 2024, in Taipei, Taiwan, where they launched the "E-Core System." This initiative, a combination ...

Dublin, Oct. 07, 2025 (GLOBE NEWSWIRE) -- The "The Global Market for Glass Substrates for Semiconductors 2026-2036" report has been added to ResearchAndMarkets.com's offering. The Global Glass ...

As commercialization of glass substrates, considered a core technology for next‑generation semiconductor packaging, approaches, SK, LG, Samsung and others are rapidly expanding partnerships with ...

TASMIT Inc. has launched a new inspection system for glass substrates as part of its INSPECTRA series of semiconductor wafer visual inspection systems, which has gained attention for its high ...

No matter what, it's clear at this point that the way forward for the semiconductor industry is chiplets, or "tiles" in Intel nomenclature. Piling multiple pieces of a processor onto one package ...

Intel has announced the industry's first Glass Core Substrate (GCS) technology for next-generation advanced packaging, which has once again attracted market discussion due to the recent AI trend. Save ...

Yole Group announced the release of its annual Status of the Advanced IC Substrates Industry report, a comprehensive market and technology analysis covering organic IC substrates, Glass Core ...

E&R's E-Core Alliance includes Manz AG, Scientech for wet etching, ShyaWei Optronics for AOI optical inspection, Lincotec, STK Corp., Skytech, Group Up for sputtering and ABF lamination equipment, and ...