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Samsung's archrival becomes first chipmaker to launch 300+ layer TLC NAND flash memory; SK Hynix's 321-layer 1-terabit TLC paves the way for more affordable 100TB+ SSDs

Samsung and SK Hynix have continued their head-to-head battle in the NAND flash memory market with the latter taking the lead with a new launch. SK Hynix, the world’s second-largest memory chipmaker, ...
Business Wire

Toshiba Develops World's First 48-Layer BiCS (Three Dimensional Stacked Structure Flash Memory)

TOKYO--(BUSINESS WIRE)--Toshiba Corporation (TOKYO: 6502) today announced development of the world’s first 48-layer *1 three dimensional stacked cell structure flash memory *2 called BiCS, a 2-bit-per ...
HotHardware

SK Hynix Takes Density Lead With Mass Production Of 238-Layer 4D NAND Flash Memory

It was around 10 months ago when SK hynix announced the development of 238-layer triple-level cell (TLC) NAND flash memory, which it markets as "4D" technology, and now it has entered the mass ...
Business Wire

Western Digital 96-Layer 3D NAND Recognized as ‘Best of Show’ at the Flash Memory Summit

SANTA CLARA, Calif.--(BUSINESS WIRE)--Western Digital Corp. (NASDAQ: WDC), a global data storage technology and solutions leader, today announced that it has received the Flash Memory Summit ‘Best of ...
Electronic Design

Between the Lines: The Next Frontier in 3D NAND Flash

Vertical scaling is vital to increasing the storage density of 3D NAND. According to imec, airgap integration and charge trap layer separation are the keys to unlocking it. Inside the charge trap cell ...
Electronic Design

3D NAND Flash Memory Stacked High at Micron

Check out more coverage of the 2022 Flash Memory Summit. Micron has started mass production of its most advanced triple-level-cell (TLC) 3D NAND chips made up of 232 layers of memory cells, pulling ...