Ensuring the reliability of multi-die assemblies requires a variety of approaches to detect subsurface defects. Bonds and interconnects are especially problematic and require more inspection ...

DRAM manufacturers continue to demand cost-effective solutions for screening and process improvement amid growing concerns over defects and process variability, but meeting that demand is becoming ...

Kristin is a lead editor at Forbes Home and has nearly a decade of professional experience as a writer and editor. She's previously worked at sites like Talking Points Memo, Insider, Delish, Angi and ...