NXP Semiconductors has claimed the industry’s first top-side cooling solution for RF power, which reduces the thickness and weight of 5G radios by more than 20 percent. The new family of top-side ...

Santa Clara, CA and Kyoto, Japan, April 27, 2023 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the industry’s thinnest[1] (H: 0.03-inch) 12W rated metal plate shunt resistor (PSR350), ...

Infineon Technologies AG has launched four power modules for hybrid and electric vehicle (xEV) main inverters. The new HybridPACK Drive modules are optimized for different inverter performance levels ...

NXP Semiconductors has announced a family of top-side cooled radio frequency (RF) amplifier modules, based on a packaging design intended to enable thinner and lighter radios for 5G infrastructure.

Learn more about TI’s latest GaN power ICs and the role that double-sided cooling plays in improving power efficiency and density. Higher switching frequencies with GaN give you the ability to use ...