Rising demand for advanced semiconductor packaging is drawing investor focus to backend technologies such as hybrid bonding. Recent updates from BE Semiconductor Industries and STMicroelectronics ...

BE Semiconductor Industries (BESI) on Thursday said its quarterly orders grew significantly in the first-quarter, helped by growth across ‌all its markets and particularly strong demand for hybrid ...

Xanadu Quantum Technologies (TSX:XNDU) has entered a partnership with EV Group to support high-volume manufacturing of photonic quantum chips. The collaboration focuses on heterogeneous integration ...

To enhance the performance of advanced logic and memory chips required for AI computing, global semiconductor equipment leader Applied Materials has unveiled new semiconductor manufacturing systems.

EV Group (EVG), a provider of innovative process solutions and expertise serving leading-edge and future semiconductor ...

Hanmi Semiconductor announced on the 22nd that it has released the 'Big Die FC (Flip Chip) Bonder' and will supply it to global customers. The company plans to expand its business area from ...

Against this backdrop, PrecisioNext's Loong series TC Bonder has achieved a historic first: completing CoWoS-L test sampling for domestic AI chips through close customer collaboration. This marks the ...