Chattanooga, Tenn. — Advanced Technical Ceramics Company offers engineers a new design guide on advanced electronic packages manufactured with co-fired multi-layer ceramic technology. Typical ...

The need to move large quantities of data at high speeds continues to increase, pressuring component manufacturers to improve their technology and, simultaneously, to reduce costs. One of the key ...

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...