NUREMBERG, Germany--(BUSINESS WIRE)--PCIM Europe – Power Integrations (NASDAQ: POWI), the leader in gate driver technology for medium- and high-voltage inverter applications, today announced the SCALE ...

The following article was originally published in eeNews Automotive. It is reprinted here with permission. Belgian company Cissoid has launched a three-phase silicon-carbide (SiC) intelligent power ...

Addressing two of the major barriers for electric vehicle (EV) adoption, charging time and the range a vehicle can travel before charging, onsemi has announced the APM32 series of silicon-carbide- ...

Automotive designers face challenges in the move to zero-emissions vehicles like hybrid and electric vehicles, including optimizing energy efficiency, increasing vehicle range, and reducing battery ...

Car manufacturers have long been investing in building up their automotive chip supply chain, and the power module sector has been attracting major investment from them. Auto makers in China are ...

Li Auto broke ground recently on its power semiconductor R&D and production base in Suzhou, China, a milestone for the electric vehicle (EV) maker. The move is a strategic one, which will allow Li ...

As more power electronic devices find their way into electrical racing vehicles, semiconductor companies and automakers partner up to develop better wideband-gap devices. Semiconductor companies are ...

KYOTO, Japan, April 24, 2025 /PRNewswire/ -- ROHM Co., Ltd. has developed new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package for power-factor-correction (PFC) circuits and LLC-resonant ...

Santa Clara, CA and Kyoto, Japan, March 20, 2023 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced that precision power analog company Apex Microtechnology is adopting ROHM’s silicon carbide (SiC ...

Santa Clara, CA and Kyoto, Japan, Oct. 27, 2021 (GLOBE NEWSWIRE) -- Zhenghai Group Co., Ltd. (Zhenghai Group) and ROHM Co., Ltd. (ROHM) have signed a joint venture agreement to establish a new company ...

Santa Clara, CA and Kyoto, Japan, April 24, 2025 (GLOBE NEWSWIRE) -- ROHM Semiconductor today announced the development of new 4-in-1 and 6-in-1 SiC molded modules in the HSDIP20 package optimized for ...