Electronics For Imaging, Inc., unveiled a wide array of innovative solutions in inkjet printing for packaging, display graphics, and textiles, all on display at its stand at drupa 2024. EFI is located ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

Advanced packaging technology continues to make waves this year after being a prominent highlight in 2023 and is closely tied to the fortunes of a new semiconductor industry star: chiplets. IDTechEx’s ...

Ottawa, Dec. 15, 2025 (GLOBE NEWSWIRE) -- The global advanced packaging market reported a value of USD 40.34 billion in 2025, and according to estimates, it will reach USD 78.75 billion by 2034, as ...

According to South Korean technology outlet , SK hynix is reviewing plans to build its first 2.5D advanced packaging mass production line in the US, a move that would deepen the South Korean memory ...