The 2026 IEEE Electronic Components and Technology Conference (ECTC) showcased how advanced packaging can redefine the scalability limits of artificial intelligence (AI) and high-performance computing ...

Terence Gan, Executive Director of Singapore's A*STAR Institute of Microelectronics (A*STAR IME), delivered a confident address at the 2025 Advanced Packaging Developers Conference (APDC), unveiling ...

Nvidia’s CEO Jensen Huang has made waves by saying that his company’s most advanced artificial intelligence (AI) chip, Blackwell, will transition from CowoS-S to CoWoS-L advanced packaging technology.

Amman, June 10 (Petra) -- The sixth Jordan Packaging Exhibition (JOPEX 2026) will open Monday at the Jordan International Exhibition Center in Mecca Mall, bringing together 22 leading local companies ...

Ottawa, Dec. 15, 2025 (GLOBE NEWSWIRE) -- The global advanced packaging market reported a value of USD 40.34 billion in 2025, and according to estimates, it will reach USD 78.75 billion by 2034, as ...