The pace of innovation in advanced packaging is rewriting the rules that IC and package teams have relied on for decades.

Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

One of the hardest aspects of game design to define is good level design. There is no set formula for organizing a layout, sculpting interrelated structures and objects in an environment, using ...

The rapid adoption of 3D integrated circuits (ICs) and heterogeneous packaging heralds a new era in semiconductor design. Benefits are clear: greater functional density, reduced footprint, and ...

Join members of the development team for a look at Operencia from a Design and 3D level building perspective as they discuss how a level comes to life, and more. Operencia: The Stolen Sun will be ...

As process nodes continue to advance into the sub-micron era, the limitations of traditional scaling are becoming increasingly evident. Larger monolithic chips are facing challenges such as higher ...

Crafting 3D models presents various hurdles, including resource constraints, tight timelines, and collaboration gaps within teams. The intricacies of texturing and animating further extend the time ...